In-situ study of creep in Sn-3Ag-0.5Cu solder
File(s)
Accepted version
Author(s)
Gu, Tianhong
Tong, Vivian
Gourlay, Christopher
Britton, Thomas
Type
Journal Article
Abstract
The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt% sample with a columnar microstructure have been investigated through in-situ creep testing under constant stress of 30 MPa at ~298 K. This is important, as 298 K is high temperature within the solder system and in-situ observations of microstructure evolution confirm the mechanisms involved in deformation and ultimately failure of the material. The sample has been observed in-situ using repeat and automatic forescatter diode and auto electron backscatter diffraction imaging. During deformation, polygonisation and recrystallisation are observed heterogeneously with increasing strain, and these correlate with local lattice rotations near matrix-intermetallic compound interfaces. Recrystallised grains have either twin or special boundary relationships to their parent grains. The combination of these two imaging methods reveal grain 1 (loading direction, LD, 10.4° from [100]) deforms less than the neighbour grain 2 (LD 18.8° from [110]), with slip traces in the strain localised regions. In grain 2, (10)[001] slip system is observed and in grain 1 (10)[1]/2 and (110)[11]/2 slip systems are observed. Lattice orientation gradients build up with increasing plastic strain and near fracture recrystallisation is observed concurrent with fracture.
Date Issued
2020-09-01
Date Acceptance
2020-06-08
Citation
Acta Materialia, 2020, 196, pp.31-43
ISSN
1359-6454
Publisher
Elsevier
Start Page
31
End Page
43
Journal / Book Title
Acta Materialia
Volume
196
Copyright Statement
© 2020 Elsevier Ltd. All rights reserved. This manuscript is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International Licence http://creativecommons.org/licenses/by-nc-nd/4.0/
Sponsor
Royal Academy Of Engineering
Engineering & Physical Science Research Council (EPSRC)
Identifier
https://www.sciencedirect.com/science/article/pii/S1359645420304377?via%3Dihub
Grant Number
RF/129
EP/R018863/1
Subjects
cond-mat.mtrl-sci
cond-mat.mtrl-sci
0204 Condensed Matter Physics
0912 Materials Engineering
0913 Mechanical Engineering
Materials
Publication Status
Published online
Date Publish Online
2020-06-14