Numerical solution of the electric field and dielectrophoresis force of electrostatic traveling wave system
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Published version
Author(s)
Type
Journal Article
Abstract
Electrostatic traveling wave (ETW) methods have shown promising performance in dust mitigation of solar panels, particle transport and separation in in situ space resource utilization, cell manipulation, and separation in biology. The ETW field distribution is required to analyze the forces applied to particles and to evaluate ETW design parameters. This study presents the numerical results of the ETW field distribution generated by a parallel electrode array using both the charge simulation method (CSM) and the boundary element method (BEM). A low accumulated error of the CSM is achieved by properly arranging the positions and numbers of contour points and fictitious charges. The BEM can avoid the inconvenience of the charge position required in the CSM. The numerical results show extremely close agreement between the CSM and BEM. For simplification, the method of images is introduced in the implementation of the CSM and BEM. Moreover, analytical formulas are obtained for the integral of Green’s function along boundary elements. For further validation, the results are cross-checked using the finite element method (FEM). It is found that discrepancies occur at the ends of the electrode array. Finally, analyses are provided of the electric field and dielectrophoretic (DEP) components. Emphasis is given to the regions close to the electrode surfaces. These results provide guidance for the fabrication of ETW systems for various applications.
Date Issued
2023-06-30
Date Acceptance
2023-06-27
Citation
Micromachines, 2023, 14 (7), pp.1347-1347
ISSN
2072-666X
Publisher
MDPI AG
Start Page
1347
End Page
1347
Journal / Book Title
Micromachines
Volume
14
Issue
7
Copyright Statement
Copyright: © 2023 by the authors.
Licensee MDPI, Basel, Switzerland.
This article is an open access article
distributed under the terms and
conditions of the Creative Commons
Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
Licensee MDPI, Basel, Switzerland.
This article is an open access article
distributed under the terms and
conditions of the Creative Commons
Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
License URL
Identifier
http://dx.doi.org/10.3390/mi14071347
Publication Status
Published
Date Publish Online
2023-06-30