Investigation of insertion method to achieve chronic recording stability of a semi-rigid implantable neural probe
File(s)
Accepted version
Author(s)
Cavuto, Matthew L
Constandinou, Timothy G
Type
Conference Paper
Abstract
Brain machine interfaces notoriously face difficulties in achieving long term implanted recording stability. It has been shown that damage and inflammation, caused during insertion by electrodes that are too large and stiff, provoke a sustained inflammatory tissue response. This is commonly referred to as the foreign body response, resulting in encapsulation and thus increased electrode impedance over time. Accordingly, neural interfaces with ever smaller and more flexible electrodes are continually in development, but unfortunately face challenges of their own, first and foremost of which is buckling and bending during insertion. This work presents the development of a prototype insertion method, comprising an insertion device and novel probe architecture, that promotes straight insertion without buckling, while simultaneously minimizing the insertion force for multi-microwire electrode probes. When compared against insertion of probes with unsupported free electrodes, the prototype method achieved significantly straighter electrode insertion, resulting in both a smaller distance between electrode recording tips and a greater average insertion depth. While achieving less straight insertion than probes with sucrose coated electrodes, a common technique for promoting reliable insertion without buckling, the tested method was able to maintain significantly lower insertion forces.
Date Issued
2019-05-20
Date Acceptance
2019-03-20
Citation
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), 2019, pp.665-669
ISBN
9781538679227
ISSN
1948-3546
Publisher
IEEE
Start Page
665
End Page
669
Journal / Book Title
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER)
Copyright Statement
© 2019 IEEE.
Sponsor
Engineering & Physical Science Research Council (EPSRC)
Identifier
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000469933200162&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=1ba7043ffcc86c417c072aa74d649202
Grant Number
EP/M020975/1
Source
9th IEEE/EMBS International Conference on Neural Engineering (NER)
Subjects
Science & Technology
Technology
Life Sciences & Biomedicine
Engineering, Biomedical
Neurosciences
Engineering
Neurosciences & Neurology
Publication Status
Published
Start Date
2019-03-20
Finish Date
2019-03-23
Coverage Spatial
San Francisco, CA, USA
Date Publish Online
2019-05-20