Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5Cu solder
File(s)Gu2019_Article_EvaluatingCreepDeformationInCo.pdf (11.54 MB)
Published version
Author(s)
Gu, T
Gourlay, C
Britton, T
Type
Journal Article
Abstract
The reliability of solder joints is affected significantly by thermomechanical properties such as creep and thermal fatigue. In this work, the creep of directionally solidified (DS) Sn-3Ag-0.5Cu wt.% (SAC305) dog-bone samples (gauge dimension: 10 × 2 × 1.5 mm) with a controlled <110> or <100> fibre texture is investigated under constant load testing (stress level: ∼ 30 MPa) at a range of temperatures from 20°C to 200°C. Tensile testing is performed and the secondary creep strain rate and the localised strain gradient are studied by two-dimensional optical digital image correlation (2-D DIC). The dominating creep mechanisms and their temperature dependence are explored at the microstructural scale using electron backscatter diffraction (EBSD), which enables the understanding of the microstructural heterogeneity of creep mechanisms at different strain levels, temperatures and strain rates. Formation of subgrains and the development of recrystallization are observed with increasing strain levels. Differences in the deformation of β-Sn in dendrites and in the eutectic regions containing Ag3Sn and Cu6Sn5 are studied and related to changes in local deformation mechanisms.
Date Issued
2019-01-01
Online Publication Date
2019-01-01
2019-01-10T12:29:21Z
Date Acceptance
2018-10-16
ISSN
0361-5235
Publisher
Springer Verlag
Start Page
107
End Page
121
Journal / Book Title
Journal of Electronic Materials
Volume
48
Issue
1
Copyright Statement
© 2018 The Author(s). Open Access.
This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
Source Database
manual-entry
Sponsor
Engineering & Physical Science Research Council (EPSRC)
Royal Academy Of Engineering
Shell Global Solutions International BV
Grant Number
EP/M002241/1
RF/129
PT61050 / PO4550133349
Subjects
0906 Electrical And Electronic Engineering
Applied Physics
Publication Status
Published
Article Number
107
Date Publish Online
2018-10-30