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Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders
File(s)
Xian et al.pdf (2.53 MB)
Accepted version
Author(s)
Xian, JW
Belyakov, SA
Britton, TB
Gourlay, CM
Type
Journal Article
Date Issued
2015-01-15
URI
DOI
ISSN
0925-8388
Publisher
ELSEVIER SCIENCE SA
Start Page
345
End Page
355
Journal / Book Title
JOURNAL OF ALLOYS AND COMPOUNDS
Volume
619
Copyright Statement
© 2014 Elsevier B.V. All rights reserved. . NOTICE: this is the author’s version of a work that was accepted for publication in Journal of Alloys and Compounds. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in JOURNAL OF ALLOYS AND COMPOUNDS, Vol.: 619, (2015) DOI: 10.1016/j.jallcom.2014.08.251
License URL
Description
04.03.15 KB. Ok to add accepted version to spiral, subject to 24 months embargo
Identifier
http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=000344429000052&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=1ba7043ffcc86c417c072aa74d649202
Publication Status
Accepted