Robust wireless power transfer to multiple mm-scale freely-positioned Neural implants
File(s)
Accepted version
Author(s)
Feng, Peilong
Constandinou, TG
Type
Conference Paper
Abstract
This paper presents a novel wireless power transfer
(WPT) scheme that consists of a two-tier hierarchy of near-
field inductively coupled links to provide efficient power transfer
efficiency (PTE) and uniform energy distribution for mm-scale
free-positioned neural implants. The top tier facilitates a tran-
scutaneous link from a scalp-worn (cm-scale) primary coil to
a subcutaneous array of smaller, parallel-connected secondary
coils. These are then wired through the skull to a corresponding
set of parallel connected primary coils in the lower tier, placed
epidurally. These then inductively couple to freely positioned
(mm-scale) secondary coils within each subdural implant. This
architecture has three key advantages: (1) the opportunity to
achieve efficient energy transfer by utilising two short-distance
inductive links; (2) good uniformity of the transdural power
distribution through the multiple (redundant) coils; and (3) a
reduced risk of infection by maintaining the dura protecting the
blood-brain barrier. The functionality of this approach has been
verified and optimized through HFSS simulations, to demonstrate
the robustness against positional and angular misalignment. The
average 11.9% PTE and 26.6% power distribution deviation
(PDD) for horizontally positioned Rx coil and average 2.6% PTE
and 62.8% power distribution deviation for the vertical Rx coil
have been achieved.
(WPT) scheme that consists of a two-tier hierarchy of near-
field inductively coupled links to provide efficient power transfer
efficiency (PTE) and uniform energy distribution for mm-scale
free-positioned neural implants. The top tier facilitates a tran-
scutaneous link from a scalp-worn (cm-scale) primary coil to
a subcutaneous array of smaller, parallel-connected secondary
coils. These are then wired through the skull to a corresponding
set of parallel connected primary coils in the lower tier, placed
epidurally. These then inductively couple to freely positioned
(mm-scale) secondary coils within each subdural implant. This
architecture has three key advantages: (1) the opportunity to
achieve efficient energy transfer by utilising two short-distance
inductive links; (2) good uniformity of the transdural power
distribution through the multiple (redundant) coils; and (3) a
reduced risk of infection by maintaining the dura protecting the
blood-brain barrier. The functionality of this approach has been
verified and optimized through HFSS simulations, to demonstrate
the robustness against positional and angular misalignment. The
average 11.9% PTE and 26.6% power distribution deviation
(PDD) for horizontally positioned Rx coil and average 2.6% PTE
and 62.8% power distribution deviation for the vertical Rx coil
have been achieved.
Date Issued
2018-12-24
Date Acceptance
2018-08-13
Citation
2018, pp.363-366
Publisher
IEEE
Start Page
363
End Page
366
Copyright Statement
© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Sponsor
Engineering & Physical Science Research Council (EPSRC)
Identifier
https://ieeexplore.ieee.org/abstract/document/8584730
Grant Number
EP/M020975/1
Source
IEEE Biomedical Circuits and Systems (BioCAS) Conference 2018
Subjects
Science & Technology
Technology
Computer Science, Information Systems
Engineering, Biomedical
Engineering, Electrical & Electronic
Computer Science
Engineering
TRANSMISSION
SYSTEM
Publication Status
Published
Start Date
2018-10-17
Finish Date
2018-10-19
Coverage Spatial
Cleveland, Ohio, USA
Date Publish Online
2018-12-24