Two-photon polymerization is a promising fabrication technique for complex 3-D structures operating at terahertz
(THz) given its sub-µm resolution with hundreds of mm3 print
volume capability. However, standard photoresins exhibit unsuitably high THz absorption and have poor mechanical, chemical,
and thermal stability. To address the latter three issues, a new
photoresin (commercially known as GP-Silica) based on silica
nanoparticles dispersed in a photocurable binder matrix has been
recently developed. To assess its suitability for THz devices, we
report the THz dielectric properties of GP-Silica and compare
them with standard 3-D printable materials. We find that GP-Silica
outperforms the other photoresins by almost five times in terms of
absorption, which finally unlocks additive manufacturing for THz
applications.