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Erratum to “3-D Printed Rectangular Waveguide 123–129 GHz Packaging for
Commercial CMOS RFICs”
File(s)
Author(s)
Zhu, Liyan
Shin, Sang-Hee
Payapulli, Roshan
Machii, Taiki
Motoyoshi, Mizuki
Type
Journal Article
Date Issued
2023-02-10
Date Acceptance
2023-01-11
Citation
IEEE Microwave and Wireless Technology Letters, 2023, 33 (2), pp.236-236
URI
DOI
ISSN
2771-957X
Publisher
IEEE
Start Page
236
End Page
236
Journal / Book Title
IEEE Microwave and Wireless Technology Letters
Volume
33
Issue
2
Copyright Statement
© 2023, IEEE. The article for this erratum can be found at https://ieeexplore.ieee.org/document/10004871. The Spiral record is https://spiral.imperial.ac.uk/handle/10044/1/101440
License URL
Sponsor
UK Space Agency
Grant Number
CT11834
Publication Status
Published