On the 3-D shape of interlaced regions in Sn-3Ag-0.5Cu solder balls
File(s)
2020_Daszki_JEM.pdf (5.03 MB)
Published version
Author(s)
Daszki, AA
Gourlay, CM
Type
Journal Article
Abstract
The microstructure of Sn-Ag-Cu (SAC) solder joints plays an important role in the reliability of electronics, and interlaced twinning has been linked with improved performance. Here, we study the three-dimensional (3-D) shape of interlaced regions in Sn-3.0Ag-0.5Cu (SAC305) solder balls by combining serial sectioning with electron backscatter diffraction. In solder balls without large Ag3Sn plates, we show that the interlaced volume can be reasonably approximated as a hollow double cone with the common 〈100〉 twinning axis as the cone axis, and the 〈110〉 from all three twinned orientations making up the cone sides. This 3-D morphology can explain a range of partially interlaced morphologies in past work on 2-D cross-sections.
Date Issued
2021-03-01
Date Acceptance
2020-09-21
Citation
Journal of Electronic Materials, 2021, 50, pp.808-817
URI
URL
DOI
ISSN
0361-5235
Publisher
Springer Science and Business Media LLC
Start Page
808
End Page
817
Journal / Book Title
Journal of Electronic Materials
Volume
50
Copyright Statement
© 2020 The Author(s). This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.
License URL
Sponsor
Engineering & Physical Science Research Council (EPSRC)
Identifier
https://link.springer.com/article/10.1007%2Fs11664-020-08508-w
Grant Number
EP/R018863/1
Subjects
Science & Technology
Technology
Physical Sciences
Engineering, Electrical & Electronic
Materials Science, Multidisciplinary
Physics, Applied
Engineering
Materials Science
Physics
Lead-free solder
interlacing
microstructure
electron backscatter diffraction (EBSD)
twinning
THERMAL-EXPANSION
GRAIN-REFINEMENT
NUCLEATION
TIN
MICROSTRUCTURE
SN
GROWTH
ORIENTATIONS
CU6SN5
COBALT
0202 Atomic, Molecular, Nuclear, Particle and Plasma Physics
0906 Electrical and Electronic Engineering
1099 Other Technology
Applied Physics
Publication Status
Published
Date Publish Online
2020-10-15