Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
File(s)
Accepted version
Author(s)
Type
Journal Article
Abstract
The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for microstructure-level modelling of solder joint reliability. Here, CTE ellipsoids are measured for key solder intermetallics using synchrotron x-ray diffraction (XRD). The role of the crystal structure used for refinement on the CTE shape and temperature dependence is investigated. The results are used to discuss the βSn-IMC orientation relationships (ORs) that minimise the in-plane CTE mismatch on IMC growth facets, which are measured with electron backscatter diffraction (EBSD) in solder joints on Cu and Ni substrates. The CTE mismatch in fully-intermetallic joints is discussed, and the relationship between the directional CTE of monoclinic and hexagonal polymorphs of Cu6Sn5 is explored.
Date Issued
2017-08-17
Date Acceptance
2017-08-02
Citation
Intermetallics, 2017, 91, pp.50-64
ISSN
0966-9795
Publisher
Elsevier
Start Page
50
End Page
64
Journal / Book Title
Intermetallics
Volume
91
Copyright Statement
© 2017, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/
Sponsor
Nihon Superior Co Ltd
Engineering & Physical Science Research Council (EPSRC)
Grant Number
N/A
EP/M002241/1
Subjects
0306 Physical Chemistry (Incl. Structural)
0914 Resources Engineering And Extractive Metallurgy
0912 Materials Engineering
Materials
Publication Status
Published