High-Temperature (> 500 degrees C) Wall Thickness Monitoring Using Dry-Coupled Ultrasonic Waveguide Transducers

File(s)

IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control_58_1_2011.pdf (784.4 KB)

Accepted version

Show more

Author(s)

Cegla, FB

Cawley, P

Allin, J

Davies, J

Type

Journal Article

Date Issued

2011-01-01

URI

http://hdl.handle.net/10044/1/13851

DOI

http://dx.doi.org/10.1109/TUFFC.2011.1782

ISSN

0885-3010

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

Start Page

156

End Page

167

Journal / Book Title

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL

Volume

58

Issue

1

Copyright Statement

© 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

License URL

http://www.rioxx.net/licenses/all-rights-reserved

Identifier

http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=000286386100015&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=1ba7043ffcc86c417c072aa74d649202

Publication Status

Published