Integrated devices for micro-package integrity monitoring in mm-scale neural implants
File(s)
Accepted version
Author(s)
Mazza, Federico
Liu, Yan
Donaldson, Nick
Constandinou, TG
Type
Conference Paper
Abstract
Recent developments in the design of active im-
plantable devices have achieved significant advances, for example,
an increased number of recording channels, but too often
practical clinical applications are restricted by device longevity.
It is important however to complement efforts for increased func-
tionality with translational work to develop implant technologies
that are safe and reliable to be hosted inside the human body
over long periods of time. This paper first examines techniques
currently used to evaluate micro-package hermeticity and key
challenges, highlighting the need for new,
in situ
instrumentation
that can monitor the encapsulation status over time. Two novel
circuits are then proposed to tackle the specific issue of moisture
penetration inside a sub-mm, silicon-based package. They both
share the use of metal tracks on the different layers of the CMOS
stack to measure changes in impedance caused by moisture
present in leak cracks or diffused into the oxide layers.
plantable devices have achieved significant advances, for example,
an increased number of recording channels, but too often
practical clinical applications are restricted by device longevity.
It is important however to complement efforts for increased func-
tionality with translational work to develop implant technologies
that are safe and reliable to be hosted inside the human body
over long periods of time. This paper first examines techniques
currently used to evaluate micro-package hermeticity and key
challenges, highlighting the need for new,
in situ
instrumentation
that can monitor the encapsulation status over time. Two novel
circuits are then proposed to tackle the specific issue of moisture
penetration inside a sub-mm, silicon-based package. They both
share the use of metal tracks on the different layers of the CMOS
stack to measure changes in impedance caused by moisture
present in leak cracks or diffused into the oxide layers.
Date Issued
2018-12-24
Date Acceptance
2018-08-13
Citation
2018, pp.295-298
Publisher
IEEE
Start Page
295
End Page
298
Copyright Statement
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Sponsor
Engineering & Physical Science Research Council (EPSRC)
Identifier
https://ieeexplore.ieee.org/document/8584761
Grant Number
EP/M020975/1
Source
IEEE Biomedical Circuits and Systems (BioCAS) Conference 2018
Subjects
Science & Technology
Technology
Computer Science, Information Systems
Engineering, Biomedical
Engineering, Electrical & Electronic
Computer Science
Engineering
Publication Status
Published
Start Date
2018-10-17
Finish Date
2018-10-19
Coverage Spatial
Cleveland, Ohio, USA
Date Publish Online
2018-12-24