THz metal mesh filters on electrically thick fused silica substrates
File(s)
Accepted version
Author(s)
Otter, WJ
Hu, F
Hazell, JF
Lucyszyn, S
Type
Conference Paper
Abstract
This paper shows simulated and measured results of ultra-low cost metal mesh filters on electrically thick substrates for millimeter-wave and THz bands. It provides a broad overview of metal mesh filters currently available and suggest why it is worth moving to an electrically thick substrate for ultra-low cost applications. We demonstrate scalable traditional metal mesh filters on 525 μm thick fused silica substrates. In addition, trapped-mode excitation is exploited to improve out-of-band rejection at higher frequencies. The measured results prove that these filters are scalable in the THz range using cost-effective micromachining manufacturing. This work opens up the possibility of using electrically thick metal mesh filters for ultra-low cost applications.
Date Issued
2014-09-14
Date Acceptance
2014-09-14
Citation
International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, 2014
Publisher
IEEE
Journal / Book Title
International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
Copyright Statement
© 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Source
Infrared Milliemter-Wave andTHz Waves Conference
Publication Status
Published
Start Date
2014-09-14
Finish Date
2014-09-19
Coverage Spatial
Tucson, Arizona, USA